SiliconAuto Expands into Physical AI at SEMICON Taiwan 2026

Industry partners are invited to visit Booth T9116, Level 7, TaiNEX Hall 2 for live demonstrations of robotics and autonomous driving semiconductor solutions

At SEMICON Taiwan 2026 Booth T9116, SiliconAuto will showcase automotive-grade silicon solutions for Physical AI, developed through collaboration across Taiwan's world-leading semiconductor ecosystem. Visitors can experience live demonstrations of technologies designed to power future robotics and autonomous driving applications. The solutions are built on the XMotiv™ M3 microcontroller and high-performance computing (HPC) platforms used in intelligent vehicles and robots.

Throughout the exhibition, the SiliconAuto team will be on hand to discuss practical approaches to Physical AI development. Topics range from semiconductor architecture and system design to multi-die integration and packaging. Visitors can also get hands-on with XMotiv™ M3 developer kits for robotic motion control, automotive body control, and safety orchestration.

Automotive-Grade Silicon, Purpose-Built for Safe and Secure Physical AI

Experience SiliconAuto technologies in action through three demonstrations, spanning robotics, autonomous driving, and high-performance computing:

XMotiv™ M3 as an ASIL-B Robotics Controller

In collaboration with Nexuni, a Taiwanese robotics developer focused on bringing AI-powered robots into practical, everyday applications, SiliconAuto is debuting a robotic motion control developer kit. XMotiv™ M3 controls dynamic stabilization through joint actuators. The demonstration highlights XMotiv™ M3's high-speed interface capabilities. These capabilities enable real-time control. ASIL-B compliance lays the safety and security foundation.

XMotiv™ M3 for Autonomous Driving

See how MCU XMotiv™ M3 works alongside ZF's I/O interface chip to support autonomous driving capabilities up to Level 4. This autonomous driving solution was first unveiled at Embedded World 2026 where it received the Embedded Award in the SoC/IP/IC Design category. The solution demonstrates XMotiv™ M3 performing safety orchestration, including system management and security functions.

Automotive and Robotics Multi-Chiplet System

Get an exclusive preview of SiliconAuto's next-generation Physical AI inference solution. The solution is built on an automotive-grade high-performance computing (HPC) chiplet architecture, designed to meet the demanding requirements of future autonomous vehicles and advanced robotics platforms. The demonstration is powered by the SiliconPilot™ digital twin, which provides a pre-silicon model for validation and development.

As Physical AI drives the emergence of autonomous vehicles and robots, SiliconAuto is helping customers bridge the gap between AI thinking and physical action. Through automotive-grade silicon solutions, built on XMotiv™ M3 microcontroller, high-performance computing (HPC) platforms, vehicle-to-everything connectivity solutions, and collaboration across Taiwan's world-leading semiconductor ecosystem, the company is enabling the next generation of safe and secure Physical AI systems.